business prospectus

Semiconductor Backend Process and Packaging

The feature of the Packaging Business

One stop service of a substrate Packaging experimental production and mass production!

We will be consistent, and handle a substrate design, part supply, packaging, assembly and quality evaluation/the guarantee and packing/shipment about wire bonding, the bare chip packaging of ACF, FCB and SMT.

SMT (Surface Mount Technology) | Total manufacturing solutions from mask production to completion of substrate mount/surface mounted…

Entrusted Business Work Flow of Prototyping/Mass Production of Mounted Devices | Receive inquiry Have a preliminary meeting with you to hear about specification(we are pleased to…

Small-quantity production of various LED! | We manufacture desired LED's of whatever amount in cooperation with our partner companies. We can …

MEMS Packaging (Sealing/Seam Welding) |Sealing Machine (semi-automatic vacuum-type seam welding machine) Applicable package size: 2.0mm - …

Mounting with ACF (Anisotropic Conductive Film) | Any request for mounting with ACF (Anisotropic Conductive Film) responded. Mounting forms includ…

Wire-Bonding | Respond to any small request for bonding:1 string of wire, 1 piece of panel, etc. Quick delivery.…

Quality Evaluation/Tests | Respond to any small requests:1 substrate, 1 panel, etc.! Quick Delivery. Mounting strength measure…

Flip-Chip Bonding | Mounting of super-thin IC's, high precision die bonding of fine chips, ACF, ESC bonding, etc. Res…

Examples of our Packaging and Prototyping Practices | We can deal with ACF bondingi, thick aluminum wire bonding, and gold ribbon bonding which tend to b…