business prospectus

Flip-Chip Bonding

Mounting of super-thin IC's, high precision die bonding of fine chips, ACF, ESC bonding, etc.

  • Respond to any small requests: 1 piece of substrate.
  • Quick delivery
  • Please feel free to consult with us about mass production.

Supported Mounting Forms

  • Mounting with ACF (Anisotropic Conductive Film)
  • Bonding with NCP (non-conductive paste)
  • Bonding with ACP (anisotropic conductive paste)
  • ESC method (adhesive containing solder particles: license required)
  • local reflow (solder bump bonding)

Combinations

  • chip + print circuit board
  • chip + FPC
  • chip + glass substrate
  • chip + silicon wafer

Please feel free to consult with us about other configurations.

Examples of Special Bonding

  • mounting of super-thin IC's
  • high precision die bonding of fine chips
  • stacking bonding (WLP)

We can provide the total line solutions from prototyping to small-quantity production (10 pieces or more) as above.