Wire Bonding equipment
Wire Bonder
UTC-2000S (Shinkawa)
Multi-Die Bonder
MD-P200 (Panasonic)
Thick Aluminum Wire Bonder
M360 (ORTHODYNE)
Desktop Dispensing Robot with PC control Image Recognition
IMAGEMASTER 350PC, SHOTMASTER 400DS-s (Musashi Engineering)
Gold Wire Bonder
HW27U-HF (Panasonic)
Flip-Chip Bonding Related Equipment
Underfiller
Underfiller
Flip-Chip Bonder
FB30T-M (Panasonic)
ACF Related Equipment
Semi-automatic ACF Applying Machine
ABM-411 (OHASHI ENGINEERING)
Sealing/Packaging
Semi-automatic Vacuum Seam Welder
NAW-1286 (Nippon Avionics)
Resin Sealing Printer
MT-320TVZ (Microtech)
Deaerator
ESM40 (EDWARDS)
SMT Related Equipment
SMT Equipment owned by our partner companies
Multi-Functional Mounter/Solder Cream Printer/High-Speed Modular Mounter Line
7-Bath N2 Reflow Furnace
7-Bath N2 Reflow Furnace
Measurement Equipments/Testers
Measuring Microscope (MF-B4020B)
MF-B4020B (Mitsutoyo)
Digital Microscope (VHX-200/VHX-1000)
VHX-200/VHX-1000 (KEYENCE)
Motorized Digital Forcegauge
FGS-100VS (SHIMPO)
Radiographic Tester
FLEX-M863 (BEAMSENSE)
X-Ray Inspecting Machine
6080F (Toshiba)
Thermal Shock Chamber
TSA-71L-A (Espec)
Bond Tester
Series 4000 (Nordson Advanced Technology)
Colorimeter
i1io (X-Rite)
Flat Panel Display Related Equipment
High precision FOG machine
ADVANCEL High precision FOG machine
FPD Optical Measuring Apparatus
Spectroradiometer CS-2000A (KONICA MINOLTA)
COG Bonder for FPD
FPX 105CG (Panasonic)
FOG Bonding Machine
AD-530SC (ADVANCEL)
ACF Transfer and Attach Machine
AD-AC-500H (ADVANCEL)
Semi-automatic Fed-Sheet Laminator
SE650n (CLIMB PRODUCTS)
FPC Bonding Machine (High-Pressure Type)
High Load Bonder FS3715 (Ishiyama)
Sliding Vacuum Heater Press
MKP-150WHV (MIKADO TECHNOS)
COG Bonder
CB-2003
FB-03
FB-03
FOG Bonder
F-20
Polarizer Bonder
Polarizer bonder
O2 Plasma Cleaner
MPS-01 (D&T)
Pressure Deaeration Machine (Autoclave)
358L(Kurihara Seisakusho)
Test Equipment
Temperature & Humidity Chamber
Temperature & Humidity Chamber (Espec: 2 units, Isuzu: 1 unit)