Semi-automatic Flip-Chip Bonder

CB501 (Athlete)

Specifications

Applicable IC size : 20mm x 20mm

Applicable substrate size : 60mm x 60mm

Bonding weight : 100g ~50kg

Manual material feeding/removing mechanism enables us to respond to requests for "non-standard" prototyping.

We can also deal with an difficult prototyping which would not be possible with a full-automatic machine.

Made by Athlete FA.