Gold Wire Bonder

HW27U-HF (Panasonic)

Specifications

Au wire diameter : Φ15μm~Φ30μm

Bonding position accuracy : ±5μm

Applicable substrate thickness : max about 10mm

Inter-pad distance : min 0.5mm~5mm (according to device spec)

*Panasonic x 3 *Shinkawa x 2