We will provide trial productions of the gold/aluminum wire bonding and the flip-chip/ACF Jissoo.

INGS SHINANO Co., Ltd owns 7 floors (total 2,500m²) of clean rooms (0.5 microns, class 500~3,000), and making much use of the facility, the company performs the cutting edge Jissoo such as COG packaging of driver IC for TFT panel module of liquid crystal projector or color liquid crystal panel of cell-phone, WB Jissoo of LED head of page printer, and assembling,  of optical equipments or information devices, in the environment in which dust, static electricity, supplying of pure water, processing of wastewater, temperature and humidity are sufficiently controlled.