business prospectus

Leave gold wire/aluminum wire bonding up to us

Any type of wire bonding can be accepted. Gold wire/aluminum wire (thin wire or thick wire)/aluminum/gold ribbon.

• Bonding of even one gold/aluminum wire or one circuit board.
• Quick delivery. Mass production is also accepted.
• Reworking and repairing
• Joint operation of test production and evaluation
• Thick material, deformed material, deep inserting
• Complex Jissoo of bare chip and SMT (small amount production is allowed with solder maskless)
Panasonic HW27U-HF
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• Equipments (wire bonding operation)
Equipment Name Maker Model Number
Gold wire bonder Panasonic HW27U-HF
Gold wire bonder Shinkawa UTC-300 Super
Aluminum and gold wedge/ball deep inserting bonder TPT Technoalpha HB-16
Aluminum thick wire/aluminum ribbon bonder Shinapex SHB-150
Manual die-bonder WEST BOND 7200CR
Plasma cleaner Samco PC-300
Bond tester (shear test, aluminum pull) DAGE series 4000
Wire pull tester (gold wire pull) DAGE BT-14

Quick delivery. mass production, reworking and repairing, thick material, deformed material, deep inserting, complex Jissoo of bare chip and SMT (small amount production is allowed with solder maskless),

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