Wire bonding Equipments
Aluminum thick wire bonder
ORTHODYNE M360
Desk-top dispensing robot with PC control image recognition
MUSASHI IMAGEMASTER350PC, SHOTMASTER400DS-s
Gold wire bonder
Panasonic HW27U-HF
Manual die-bonder
WEST・BOND 7200CR
Aluminum thick wire/aluminum ribbon bonder
SHB-150 (Shinapex)
Aluminum/gold wedge, ball bonder
HB-16 (TTP: Technoalpha)
Flip-chip (high precision) bonder
Panasonic FCB3
ACF Equipments
O2 plasma cleaner
D & T　MPS-01
Pressure defoaming device (autoclave)
Kurihara 358L
ACF applying equipment
KIda ACF-01
Flip-chip (high precision) bonder
Panasonic FCB3
ACF bonding equipment
Kida ACFMP-08
Measurement Equipments/Testers
Motorized digital forcegauge
SHINPO FGS-100VC
Radiographic Inspector
FLEX-M863（BEAMSENSE）
Digital microscope
VHX-200 (KEYENCE)
Measuring microscope
MF-B4020B (Mitsutoyo)
Constant temperature and humidity chamber
PWL-3KP (Espec)
Thermal shock chamber
TSA-71L-A (Espec)
Bond tester
Series 4000 (Dage)
Color measuring device
X-Rite i1iO
Others
Hydraulic injection molder
Nissei Plastic Industrial FN2000
Electric injection molder
Nissei Plastic Industrial NEX180
Constant temperature and humidity chamber
Constant temperature and humidity chamber (Espec product ×2, Isuzu ×1)
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