Business Prospectus
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Quick delivery and small quantity manufacturing of information and optical devices.
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Satisfying our customer with our I-JIT manufacturing system
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Examples of the test Jissoo product operation
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Leave gold wire/aluminum wire bonding up to us
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Jissoo test production/evaluation/mass production
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Flip-chip bonder (high precision die-bonding and ACF/ESC Jissoo)
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ACF (Anisotropic Conductive Film) Jissoo
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Comprehensive recycling operation for environment preservation
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Thermoelectric conversion power generator unit
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Peltier power generation kit (amphibian)
Equipment
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Aluminum thick wire bonder
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Desk-top dispensing robot with PC control image recognition
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Gold wire bonder
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Manual die-bonder
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Aluminum thick wire/aluminum ribbon bonder
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Aluminum/gold wedge, ball bonder
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Flip-chip (high precision) bonder
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O2 plasma cleaner
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Pressure defoaming device (autoclave)
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ACF applying equipment
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Flip-chip (high precision) bonder
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ACF bonding equipment
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Motorized digital forcegauge
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Radiographic Inspector
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Digital microscope
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Measuring microscope
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Constant temperature and humidity chamber
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Thermal shock chamber
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Bond tester
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Color measuring device
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Hydraulic injection molder
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Electric injection molder
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Constant temperature and humidity chamber
Corporate Profile
