Semi-automatic Flip-Chip Bonder
Applicable IC size : 20mm x 20mm
Applicable substrate size : 60mm x 60mm
Bonding weight : 100g ~50kg
Manual material feeding/removing mechanism enables us to respond to requests for "non-standard" prototyping.
We can also deal with an difficult prototyping which would not be possible with a full-automatic machine.
Made by Athlete FA.