One stop service of a substrate Packaging experimental production and mass production!
We will be consistent, and handle a substrate design, part supply, packaging, assembly and quality evaluation/the guarantee and packing/shipment about wire bonding, the bare chip packaging of ACF, FCB and SMT.
- An experimental production and a little mass production (10 unit) will correspond.
- We will handle it from dice cutting of an IC chip, tray loading and the back grind. we also receive the modularizing.
- We will handle rework from 1 wire/a repair.