The feature of the Packaging Business
One-stop service for board bonding prototype and mass production
For wire bonding, bare chip bonding such as ACF and FCB, and SMT, we consistently handle board design, material procurement, bonding, assembly, quality evaluation / guarantee, packaging / shipping, etc.
- We support trial production to mass production.
- We accept IC chip dicing, tray transfer, and backgrinding. We also accept modularization.
- We accept rework / repair from one wire.
