Semi-automatic ACF Applying Machine ABM-411 (OHASHI ENGINEERING) Specifications This is semi-automatic machine, we will make a small turn and support trial production in small quantities.
ACF Main Crimping Machine Specifications ACF can be bonded on a large panel Board size : 20 inch panel ~ compatible Substrate thickness : 0.4 mm to 2.5 mm Head pressure : 30-900N / head (5-30kgf / head) Head pressurization time : 0.1-99.9sec variable Head heating method : Room temperature to 350 ° C (cartridge heater)
ACF Bonding Machine Specifications Connection between glass substrate (panel) and FPC using ACF (anisotropic conductive film) COG (Chip On Glass), COF (Chip On Film), etc. Applications as a connector substitute / solder substitute