ACF Related Equipment

ABM-411 (OHASHI ENGINEERING)


Specifications
  • This is semi-automatic machine, we will make a small turn and support trial production in small quantities.


Specifications
  • ACF can be bonded on a large panel
  • Board size : 20 inch panel ~ compatible
  • Substrate thickness : 0.4 mm to 2.5 mm
  • Head pressure : 30-900N / head (5-30kgf / head)
  • Head pressurization time : 0.1-99.9sec variable
  • Head heating method : Room temperature to 350 ° C (cartridge heater)


Specifications
  • Connection between glass substrate (panel) and FPC using ACF (anisotropic conductive film)
  • COG (Chip On Glass), COF (Chip On Film), etc.
  • Applications as a connector substitute / solder substitute