Flip-Chip Bonding Equipment

Specifications

Stage size : 100 x 100 mm
Die size : 1 x 1 mm to 20 x 20 mm
Head-stage parallelism : ± 3 micron / 20 mm □
± 20 micron / 100 mm □
Pressurized range : 100-5000N
Heating range : Max 300 ℃
Nitrogen purge is possible

FCB3 (Panasonic)

Specifications

Board size : 50 x 50 mm to 330 x 250 mm
Die size : 1 x 1 mm to 20 x 20 mm
Bonding accuracy : 3 micron / 3σ Pressurization range: 5 to 490 N
Heating range : Max 500 ℃
Tip supply : WF / Max 8 inch or 2 inch tray / 4 inch tray

FCB3 (Panasonic)

Specifications

Bonding position accuracy : 3 micron / 3σ (manufacturer's guaranteed spec.)
High-precision bonding of 0.3 mm square LED bare chips is possible
Pressurized range : 5N to 490N
Heating range : Max.500℃
ESC method is possible