Panel Display Equipment

We have a lot of equipment for FOG, COG and COF mounting for display.
This allows us to provide assembly services for a variety of sizes and accuracies.


High precision FOG machine

  • Mounting accuracy: ±4 μm 3σ (26 μm pitch compatible)
  • Pulse heat head capability:
  • temperature rise: room temperature -> 450 °C : 2 seconds
  • cooling: 450 °C -> room temperature 30 seconds
  • *Low temperature ACF (high reaction ACF) compatible / connection part voidless
  • High load head capability: 2000N
  • Corresponding size: 1 to 17 in
  • Equipment cycle time: 15 sec / 1 FPC
  • Wet cleaning / Plasma cleaning function included


COG Bonder for FPD

  • Supports 1 to 17-inch-size panel
  • High versatility through 2-side bonding (supplying up to 6 IC's)
  • Automatic operation from ACF attachment through pre-bonding to final bonding
  • Supports multiple IC's packaging and small-quantity production

FOG Bonding Machine

  • Maker : ADVANCEL
  • Model : AD-530SC
  • Applicable panel (PCB) dimension : max W 500mm (supported panel size range : 6-inch~23-inch)
  • Pressure cylinder stroke : 30mm
  • Pressure head thrust : max 503kgf


ACF Transfer and Attach Machine

Maker : ADVANCEL
Model AD-AC 500H
Applicable panel (PCB) dimension : max W 500mm (supported panel size range : 6-inch~23-inch)
Applicable Panel (PCB) thickness : 0.4~1.0mm
ACF width : 1.0~3.0mm
Pressure range : 290~1080N (30~110kgf)



FPC Bonding Machine (High-Pressure Type)

Pressure : 20~140kgf
Temperature : room temperature~500℃
Bonding time : 0~99.9 seconds
Applicable panel size : 150 x 100~450 x 250mm
Applicable FPC size : 40 x 20~450 x 250mm
ESD protection : Ionizing air blower on both sides



Semi-automatic Flip-Chip Bonder

  • Applicable IC size : 20mm x 20mm
  • Applicable substrate size : 60mm x 60mm
  • Bonding weight : 100g ~50kg
  • Manual material feeding/removing mechanism enables us to respond to requests for "non-standard" prototyping.
  • We can also deal with an difficult prototyping which would not be possible with a full-automatic machine.


Semi-automatic ACF Applying Machine

Being "semi-automatic" makes it possible to meet more variable requirements for prototyping/small quantity production.



COG Bonder

  • Applicable panel dimension : 5 inch
  • Dr length : 55mm
  • Bonding accuracy : ±4.5μm


FB-03

  • Applicable panel dimension : 150mm x 150mm


FOG Bonder

  • Applicable panel dimension : 5 inch
  • Bonding length : 55mm


ACF Transfer and Attach Machine