Printing machine for resin encapsulation
MT-320TVZ (Microtech)
Specifications
- Until now, only potting with a dispenser was supported, but this machine has improved the mass production capacity of resin encapsulation.
- Board size : □ 250mm
Underfill machine
Underfiller
Specifications
- Suitable for underfill of relatively small inserts of Φ2mm to Φ4mm
- By changing the tray, it can be applied not only to underfill but also to drawing and coating resin.
- Model of on-board dispenser: Sanei Tech e.star (= Akim Tech ACJ-3)
- * High-speed electromagnetically controlled non-contact dispenser
Desktop coating system with position correction function
IMAGEMASTER 350PC, SHOTMASTER 400DS-s (Musashi Engineering)
Specifications
- 3D alignment function: Supports correction according to the inclination and swell of the pallet and work piece
- View camera: It is possible to measure coating dimensions from coating observation
- Equipped with application preview function: It is possible to check the coating pattern and coating line width
Defoamer
ESM40 (EDWARDS)
Specifications
- The capacity of the COB resin encapsulation process will be improved when combined with the resin encapsulation printing machine.
- As the machines for die bonders and wire bonders has been expanded, the resin sealing capacity has also increased, so we will respond to customer requests with greater mass production capabilities.
Semi-automatic vacuum seam welder
NAW-1286 (Nippon Avionics)
Specifications
- Package size : □ 2.0mm ~ □ 60mm
- Sealing pressure : Atmospheric pressure to high vacuum (5 x 10-3 pa or less)
- Sealing gas : N2 (consultation required for other gases)
- Supports MEMS prototypes and small-lot production