SMT Related Equipment


Specifications
  • Board size : □ 20 mm to □ 300 mm, t = 0.3 mm to 10 mm
  • Chip size : □ 0.1mm ~ □ 1.3mm
  • On-board bonding accuracy : ± 0.025 mm (3σ) in both XY directions, ± 3 ° in θ direction
Work supply system
  • Board : Magazine
  • Chip : Seat ring (GR4-8in)
  • Paste : Paste stage (stamping) or syringe (dispens) * Selectable



We have introduced two die bonders that can be used for multiple purposes. It is a versatile machine not only for LED bare dies, but also for RFID mounting and die bonding of minute chips in MEMS creation.
We have been good at assembling with COB of fine bare dies, such as sensor assembly, receiving / emitting element bonding, non-contact short-distance data transfer module manufacturing, etc.


MD-P200 (Panasonic)


Specifications
  • Model (product number): Panasonic MD-P200 (NM-EFD1B)
  • Mounting accuracy: XY: ± 15 μm, θ: ± 0.3 ° 3σ
  • Die dimensions: L 0.25 mm x W 0.25 mm to L 6 mm x W 6 mm (up to 2 mm □)
  • Die supply form: flat ring, semi-expanding ring, waffle tray

7200CR (WEST BOND)


Specifications
  • Used for die bonding of fine chips such as LED bare chips
  • Surface mounting is also possible by using cream solder (with a track record of 0402 chips)