Mini LED Die Bonder
Specifications
- Board size : □ 20 mm to □ 300 mm, t = 0.3 mm to 10 mm
- Chip size : □ 0.1mm ~ □ 1.3mm
- On-board bonding accuracy : ± 0.025 mm (3σ) in both XY directions, ± 3 ° in θ direction
Work supply system
- Board : Magazine
- Chip : Seat ring (GR4-8in)
- Paste : Paste stage (stamping) or syringe (dispens) * Selectable