Wire Bonding equipment

Ultrasonic Engineering

Specifications

We will be able to handle COBs with a large number of wires that require thin aluminum wires and make a wide range of contracts.
Wire diameter : 25 to 50 micron
Bonding area : 300 x 160 mm

UTC-2000S (Shinkawa)

Specifications

We installed to improve the responsiveness of gold wire bonding supports not only narrow pitch bonding but also stud bumping
Pad pitch : 50 micron
Board size : 80 x 250 mm
With stud bump processing option

IConn (K&S)

Specifications

Wide bond area : (X) 56 x (Y) 80
High-precision bonding : Bonding accuracy ± 2.0 micron
Latest loop control
Supports board types with dual frequency and programmable lighting
gold wire bonding : Φ15-50 micron
Wire length (when using Φ25 micron) : maximum 7.6 mm

M360 (ORTHODYNE)

Specifications

Aluminum wire diameter : φ125 to φ500 micron available
Bonding area : 250 x 150 mm
Bonding head : Rotary head
Bonding distance : 40mm MAX
Z direction operation : 50mm Z axis distance

HW27U-HF (Panasonic)

Specifications

Au wire diameter : φ15 to φ30 micron available
Bonding : Positional accuracy ± 5 micron
Board thickness : Supports up to about 10 mm
Distance between pads : Minimum 0.5 to 5 mm (device specifications)

HB-16 (TPT : Technoalpha)

Specifications

Wedge bond compatible Al wire diameter : φ17 to φ75 micron
Wedge bond compatible Au linear : φ17 to φ75 micron
Ribbon bond compatible Au / Al wire : Maximum 25 x 200 micron
Ball bond compatible Au linear : φ17 to φ50 micron
Deep hit distance : 12mm
Y-axis motor control distance : 12mm (≈ loop length setting)