Autoclave
Vacuum bonding machine
High-precision FOG mounting machine
Semi-automatic sheet-fed laminating machine (high precision type)
47 inch film laminating machine
Assembly accuracy measuring machine
High precision back-light assembly machine
COG bonding machine for FPD
FOG bonding machine
ACF bonding machine
Semi-automatic sheet-fed laminating machine
High-precision laminating machine
FPC bonding machine (high pressure type)
Semi-automatic flip chip bonding machine
Semi-automatic ACF bonding machine
COG bonding machine
O2 plasma cleaning machine
Panel cleaning machine
Rotary Head (Automatic) Thin Aluminum Wire Bonder
Wire Bonder
Wire Bonder supporting Cupper Wire
Thick Aluminum Wire Bonder
Gold Wire Bonder
Aluminum/Gold Wedge/Ball Deep Access Bonder
High precision pressurization / heating Gangbonder
Flip-Chip Bonder
Flip-Chip (High-Precision) Bonder
Semi-automatic ACF Applying Machine
ACF Main Crimping Machine
ACF Bonding Machine
Mini LED Die Bonder
LED bare die compatible die bonder
Multi die bonder
Manual die bonder
About various laminating technologies
Laminating and assembling the liquid crystal panel
Design contract service
Prototype development evaluation of production goods
Work flow for bonding prototypes and mass production
Quality evaluations / tests
Measuring instrument testing machine
X-ray transmission inspection equipment
Digital microscope (VHX-200 / VHX-1000)
Microscope (MF-B4020B)
Constant temperature and humidity tester
Thermal impact tester
Bond tester
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