We will provide trial productions of the gold/aluminum wire bonding and the flip-chip/ACF Jissoo.

TOYOTA JIT system is introduced into the production line to establish higher efficient production system for providing quicker delivery and higher quality products to our customers.

Cutting edge fine device packaging such as TFT panel module, COG packaging or LED head WB Jissoo.

Recycling operation for environment preservation such as waste plastic high quality material recycling.

Unique product development based on our manufacturing skill.