ACF Main Crimping Machine

Specifications

• ACF can be bonded on a large panel
• Board size : 20 inch panel ~ compatible
• Substrate thickness : 0.4 mm to 2.5 mm
• Head pressure : 30-900N / head (5-30kgf / head)
• Head pressurization time : 0.1-99.9sec variable
• Head heating method : Room temperature to 350 ° C (cartridge heater)