LED bare die compatible die bonder | SMT Related Equipment | INGS SHINANO Co., Ltd. Fine-Pitch Mounting and Flat-Panel Display Technology

SMT Related Equipment

We have introduced two die bonders that can be used for multiple purposes. It is a versatile machine not only for LED bare dies, but also for RFID mounting and die bonding of minute chips in MEMS creation.
We have been good at assembling with COB of fine bare dies, such as sensor assembly, receiving / emitting element bonding, non-contact short-distance data transfer module manufacturing, etc.