Aluminum/Gold Wedge/Ball Deep Access Bonder
HB-16 (TPT : Technoalpha)
Specifications
- Wedge bond compatible Al wire diameter : φ17 to φ75 micron
- Wedge bond compatible Au linear : φ17 to φ75 micron
- Ribbon bond compatible Au / Al wire : Maximum 25 x 200 micron
- Ball bond compatible Au linear : φ17 to φ50 micron
- Deep hit distance : 12mm
- Y-axis motor control distance : 12mm (≈ loop length setting)