Display Business


In the field of Flat Panel Displays (FPD), enhancement of image definition, reduction of panel thickness and narrowing of frame width are being accelerated today. We are always watching the market trend and proactively introduce new technology in mounting and assembly in order to meet our customers' needs and requirements.

  • Increase of the number of connector terminals due to enhancement of image definition
     -> Introduced high-precision, heavy-duty bonder
  • Tighter precision requirement for bonding positions due to reduction of frame width
     -> Introduced high-precision bonder
  • Requirement for higher level of assembly skills due to reduction of panel thickness
     -> Have an vast accumulation of experience in development and prototyping of state-of-the-art products


Problem Solutions in Panel Mounting Business


Miniaturization associated with higher-density COG

Performance of ACF bonding at the time around the year of 2000
*Chip Size:~22mm *Pitch:90μm(COG)

Performance of ACF bonding now
*Chip Size:~35mm *Pitch:36μm(COG)

  • Pressure-bonding temperature -> balance between reliability assurance and low temperature
  • Pressure thrust (Pressure)
  • Pressure-bonding time -> balanced with productivity
  • Parallelism of head -> more stringently controlled


Miniaturization associated with higher-density FOG


Performance of ACF bonding at the time around the year of 2000
*Connection Length:~40mm *Pitch:200μm

Performance of ACF bonding now
*Connection Length:~150mm *Pitch:70μm(center portion)

  • Pressure-bonding temperature -> as low as possible
  • Pressure thrust (Pressure)
  • Pressure-bonding time -> temperature profile controlled
  • Parallelism of head -> more stringently controlled


Repair of Polarizer (Remove an old polarizer→bond a new polarizer)



  • work size: ~15inch
  • panel thickness (Min):0.3mm~(CF: 0.15mm, TFT: 0.15mm)
  • LCD:can be recycled POL:cannot be recycled

Repair of COG (Remove an old DrIC→Bond a new DrIC)



  • DrIC length (Max): ~32mm
  • panel thickness (Min): 0.3mm~ (CF:0.15mm, TFT:0.15mm)
  • LCD:can be recycled DrIC:cannot be recycled

Repair of FPC Bonding and Removal of ACF (Remove an old FPC→Bond a new FPC)



  • panel thickness (Min):0.3mm~ (CF:0.15mm, TFT:0.15mm)
  • In some parts, removed FPC can be reused and bonded.
  • LCD:can be recycled some FPC:can be recycled

Repair of Bonding junction (Remove an old CG→bond a new CG)



  • work size (Max):~7inch *For work of 12 inch or more, consult with us.
  • panel thickness (Min):0.3mm~ (CF:0.15mm, TFT: 0.15mm)
  • LCD:can be recycled CG:can be recycled POL:cannot be recycled

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