Flip-Chip Bonder
FCB3 (Panasonic)
Specifications
- Board size : 50 x 50 mm to 330 x 250 mm
- Die size : 1 x 1 mm to 20 x 20 mm
- Bonding accuracy : 3 micron / 3σ Pressurization range: 5 to 490 N
- Heating range : Max 500 ℃
- Tip supply : WF / Max 8 inch or 2 inch tray / 4 inch tray