Flip-Chip (High-Precision) Bonder
FCB3 (Panasonic)
Specifications
- Bonding position accuracy : 3 micron / 3σ (manufacturer's guaranteed spec.)
- High-precision bonding of 0.3 mm square LED bare chips is possible
- Pressurized range : 5N to 490N
- Heating range : Max.500℃
- ESC method is possible