Flip-Chip Bonding Equipment


Specifications
  • Stage size : 100 x 100 mm
  • Die size : 1 x 1 mm to 20 x 20 mm
  • Head-stage parallelism : ± 3 micron / 20 mm □  
      ± 20 micron / 100 mm □
  • Pressurized range : 100-5000N
  • Heating range : Max 300 ℃
  • Nitrogen purge is possible