Semi-automatic flip chip bonding machine
CB501 (Athlete)
Basic specifications
- Corresponding IC size: 20mm × 20mm
- Corresponding board size: 60mm × 60mm
- Weighting capacity: 100g-50kg
- Heating capacity: Room temperature to 500 ° C (setting)
By manual operation for the supply and removal materials of the product, it is possible to respond to "non-standard" prototypes with a small turn.
We accept contracts for difficult prototypes that are difficult to handle with fully automatic machines.