Display-related equipment


Basic specifications
  • Bonding accuracy: ± 4 μm 3σ (26 μm pitch available)
  • Pulse heat head capability:
  • ◎ Temperature rise: Room temperature → 450 ℃ / 2 seconds
  • ◎ Cooling: 450 ℃ → Room temperature / 30 seconds
  • * Low temperature ACF (high reaction ACF) compatible / Connection void-less
  • High load head capacity: 2000N
  • Corresponding size: 1 to 17in
  • Equipment cycle time: 15 seconds / 1FPC
  • With wet cleaning / plasma cleaning function