High-precision FOG mounting machine
Basic specifications
- Bonding accuracy: ± 4 μm 3σ (26 μm pitch available)
- Pulse heat head capability:
- ◎ Temperature rise: Room temperature → 450 ℃ / 2 seconds
- ◎ Cooling: 450 ℃ → Room temperature / 30 seconds
- * Low temperature ACF (high reaction ACF) compatible / Connection void-less
- High load head capacity: 2000N
- Corresponding size: 1 to 17in
- Equipment cycle time: 15 seconds / 1FPC
- With wet cleaning / plasma cleaning function