FPC bonding machine (high pressure type)
Basic specifications
- Pressurized pressure: 20 - 140 kgf
- Set temperature: Room temperature to 500 ℃
- Bonding time: 0 - 99.9 seconds
- Corresponding panel size: 150 × 100-450 × 250 mm
- Corresponding FPC size: 40 × 20-450 × 250 mm
- ESD measures: Static discharge blower from the side of the stage
