Jisso Business

Flip chip bonding (ACF) & ACF crimping

Any request for mounting with ACF
(Anisotropic Conductive Film) responded.

  • Mounting forms include interconnection between glass substrate (panel) and FPC, COG (Chip On Glass) bonding, COF (Chip On Film) bonding, substitution for connector or solder, etc.
  • We can provide the total line solutions from prototyping to small-quantity production (about 10 to 5,000 pieces).

COF (Chip on Film) implementation image

Main Mounting Forms

Mounting with ACF (Anisotropic Conductive Film)

  • interconnection between glass substrate (panel) and FPC
  • COG (Chip On Glass) bonding
  • COF (Chip on FPC) bonding
  • used as an alternative for connector - interconnection with ACF between FPC and PCB avoids needs for connectors

Other Available Services

  • Respond to all requests for bonding of 1 piece of substrate, 1 piece of panel, etc.
  • Quick delivery
  • Procure ACF for you from:
    ・Hitachi Chemical Company
  • Feel free to consult with us about mass production.

Click here for inquiry and quotation request.