- Respond to any small request for bonding:1 string of wire, 1 piece of panel, etc.
- Quick delivery.
- Heavy cutting, irregular shape, deep access, etc.
- Hybrid mounting of bare chip and SMT (Surface Mount Technology) (We will support small-quantity production without solder mask.)
- Rework/repair work of even one piece of wire available
- gold wire
- aluminum wire (thick, thin)
- gold wire ribbon
- aluminum wire ribbon
Precise Fine-Pitch Bonding
Precise fine-pitch mounting less than 1mm square of any amount from 1 piece to large quantity.
Wire Material/Main Use
|Wire Material||Main Dimension||Main Use|
|thin aluminum wire||Φ25-75μm||COB|
|thick aluminum wire||Φ100-500μm||suitable for power devices in which large current flows|
|gold ribbon||-||suitable for high frequency devices|
Bonding Type/Main Use
|Bonding Type||Main Use|
|ball bonding||most commonly used|
|wedge bonding||used for power device in which large current flows, IC's for vehicle used under harsh conditions|
Just provide us with your specification / drawings.
Then we can handle the total line of operations : Leave it to us !
- Board Design↓
- Required Materials procurement↓
*Respond to request for back grind and dicing of IC chips and tray conveyance.
- Rework / Repair↓
- Quality Evaluation / Assurance↓