Wire-Bonding
Panasonic HW27U-HF
- Respond to any small request for bonding:1 string of wire, 1 piece of panel, etc.
- Quick delivery.
- Heavy cutting, irregular shape, deep access, etc.
- Hybrid mounting of bare chip and SMT (Surface Mount Technology) (We will support small-quantity production without solder mask.)
- Rework/repair work of even one piece of wire available
Bonding Material/Profile
- gold wire
- aluminum wire (thick, thin)
- gold wire ribbon
- aluminum wire ribbon
Precise Fine-Pitch Bonding
Precise fine-pitch mounting less than 1mm square of any amount from 1 piece to large quantity.
Wire Material/Main Use
| Wire Material | Main Dimension | Main Use |
|---|---|---|
| gold wire | Φ18-50μm | COB |
| thin aluminum wire | Φ25-75μm | COB |
| thick aluminum wire | Φ100-500μm | suitable for power devices in which large current flows |
| aluminum ribbon | - | |
| gold ribbon | - | suitable for high frequency devices |
Bonding Type/Main Use
| Bonding Type | Main Use |
|---|---|
| ball bonding | most commonly used |
| wedge bonding | used for power device in which large current flows, IC's for vehicle used under harsh conditions |
Just provide us with your specification / drawings.
Then we can handle the total line of operations : Leave it to us !
- Board Design↓
- Required Materials procurement↓
*Respond to request for back grind and dicing of IC chips and tray conveyance. - Mounting↓
- Assembly↓
- Rework / Repair↓
- Quality Evaluation / Assurance↓
- Delivery
Click here for inquiry and quotation request.