Examples of our Packaging and Prototyping Practices

Ordering Information (Unit/Form)
MEMS Package (Sealing/Seam welding)

• sensor of sealing with seam welding
• gas seal with N2 and other gases
• checking with leak testers
• quartz crystal oscillator, etc.

Bonding Material/Method

• 電解Ni
• 無電解Ni
• 金錫

Ordering Information (Unit/Form)
Middle to Small-Scale LCD Panel

• flip-chip bonding of Dr-IC on panel with ACF (COG)
• flip-chip bonding of Dr-IC on FPC with ACF (COG)
• interconnection between LCD panel and FPC with ACF (FOG)
• from design to prototyping of display unit
• OCA, OCR bonding
• mounting and assembly of touch panel

Bonding Material/Method

ACF (to ACF Mounting page)

Ordering Information (Unit/Form)
Print Head

• mounting of Dr-IC on ceramic substrate with ACF
• interconnection between control board and FPC with ACF
• die-bonding/thin aluminum wire bonding of LED elements
• interconnection between PCB and ceramic substrate with gold wire bonding

Bonding Material/Method

• ACF (to ACF Interconnection page)
• thin Aluminum wire (to Wire Bonding page)
• Gold wire (to Wire Bonding page)

Ordering Information (Unit/Form)
Display/Dial Face Light-Emitter

• die-bonding/thin aluminum wire bonding of LED on FPC
• die-bonding/gold ball bonding
• wire connection by gold ball bonding between PCB and glass substrate of digital display (EPD)

Bonding Material/Method

• thin Aluminum wire (to Wire Bonding page)
• gold wire (to Wire Bonding page)

Ordering Information (Unit/Form)
Chip Mounting of High Frequency Circuit Board

• mounting by gold ribbon bonding

Bonding Material/Method

• gold ribbon (to Wire Bonding page)

Ordering Information (Unit/Form)
Power Supply Circuit

• die bonding/thick Aluminum wedge bonding of IGBT to PCB

Ordering Information (Unit/Form)
Control Board

• interconnection between PCB and FPC with ACF

Bonding Material/Method

• thick Aluminum wire (to Wire Bonding page)
• Aluminum ribbon (to Wire Bonding page)
• ACF (to ACF Mounting page)

Ordering Information (Unit/Form)
Sensing Portion

• high-precision die bonding/gold wire bonding of PD to FPC
• high-precision die bonding/gold wire bonding of LED to FPC

Bonding Material/Method

• gold wire (to Wire Bonding page)

Ordering Information (Unit/Form)
Image Sensor

• high-precision die-bonding/gold ball bonding of large-scale CMOS sensor to ceramic PKG

Bonding Material/Method

• gold wire (to Wire Bonding page)

Ordering Information (Unit/Form)
RF Element Mounting

• RF element mounting on paper substrate (Heat and Pressure FCB/gold WB)

Bonding Material/Method

• gold wire (to Wire Bonding page)

Ordering Information (Unit/Form)
Board for GPS

• C4 mounting of GPS functional IC

Bonding Material/Method

• Solder (to Flip-Chip Bonder page)

Ordering Information (Unit/Form)
Resin Bonding Material Development/ Ceramic Bonding Material Development/Plating Evaluation/Engineering Plastic Bonding Material Evaluation

• evaluation of prototype of newly developed circuit board
• evaluation of products made in factories abroad
• mountability evaluation for development of various bonding materials

Bonding Material/Method

• X-ray inspection, bonding strength measurement, thermal shock test, heat cycle test (to Quality Evaluation/Tests page)

Order Information (Unit/Form)
Repair of Developed Product/Wire Bonding Rework/Prototyping of New Product at Early-stage of Development Without Applying Mounting Rules

• We want to make good use of the few prototype IC's and substrates. Can we recycle and reuse those after test and evaluation?
• Some wire accidentally collapsed during evaluation.
• We have made a prototype and its profile exceeds the specs of our own machine, but we want to transfer it to mounting by all means.

Bonding Material/Method

• Ggold wedge bonding, gold ribbon bonding, thick aluminum wire bonding, aluminum ribbon bonding, thin aluminum wire bonding (to Wire-Bonding page)