We carry out integrated production from mask manufacturing to board mounting and surface mounting unit completion.
- Supports a wide variety of products with high-speed, high-precision mounting on boards and surface mounts.
- We meet a wide range of high-density board mounting needs.
- We can handle everything from prototype board mounting and surface mounting to mass production.
- Nitrogen reflow (N2 reflow) is available.
- We will inspect with BGA installed and X-ray fluoroscope.
In order to quickly respond to the ever-accelerating electronicization of various devices and their small size, light weight, multi-functionality, and high performance, we have introduced a state-of-the-art mounting line, from board design to parts procurement, trial production, and mass production. We can handle a wide range of applications such as dipping, dipping, and hand soldering.
We will meet various needs with high technology of board mounting and surface mounting and thorough quality control ability.
Board mounting / surface mounting (SMT)
- Not only PCB boards, but also FPC boards for board mounting and surface mounting.
- Supports narrow pitch and extremely small parts such as CSP, BGA, QFP, 0402, 0603, which require a mounting system for board mounting.
- We have 8-zone N2 reflow, and the optimum temperature profile can be set by mounting on a board.
- RoHS compliant and lead-free from the viewpoint of environmental protection.
- Board size for board mounting and surface mounting
50 mm x 50 mm to 250 mm x 330 mm t = 50 μm to 2.0 mm
Printing mask production
We will manufacture it from the manufacturing data of the board.
We manufacture not only Gerber data and DXF data but also boards.
- Laser method
A highly accurate metal mask that is laser processed.
Suitable for surface board mounting with 0.4 mm fine pitch.
- Etching method
A metal mask with stable accuracy due to photo-etching. Suitable for general density surface board mounting.
- Additive method
A highly accurate metal mask made by electroforming.
Suitable for high-density surface board mounting with an ultra-fine pitch of 0.3 mm. Since the cross section of the opening is smooth, the paste solder can be easily removed.