What is ACF crimping?
ACF crimping is an electrical connection process using ACF (anisotropic conductive film).
ACF crimping is used on various substrates such as FPC and PCB (printed circuit board), FPC and FPC, FPC and PET film.
The feature of ACF connection is that it can be bonded with a lower profile and a narrower pitch than soldering or connector connection.
About 100 μm pitch between films (FPCs and films such as FPC, PET and PEN), about 80 μm pitch between films and rigid bodies (FPC and glass, etc.), 40 μm between rigid bodies (IC on glass, etc.) We can make fine pitch connections such as pitch.
By devising the design and materials, it is possible to further support fine pitch bonding.
The photo above is an example of ACF bonding FPC on a glass capacitive touch panel. It is called FOG (FPC on Glass) because FPC is bonded on glass.
In addition to this, it is also used as a PCB board and FPC (FOB), and a combination thereof (FOG and FOB).
How to proceed with ACF crimping
ACF crimping is a process in which an ACF is sandwiched between materials and heat and pressure are applied to perform electrical connection and physical fixation. for that reason,
- Select an appropriate ACF according to the type of material
- The shape of the electrode should be suitable for ACF connection.
Based on the above points, Ings Shinano can provide design support and procurement agency, and can perform ACF crimping.
(It is also possible to supply all materials and perform only crimping under specified conditions.)
Please feel free to contact us even if you have never used ACF before.
ACF connections are used in many places.
Please refer to the technical introduction pages for COG, COF, COB, and FOG, which are particularly versatile.