Technology introduction

Bonding the driver IC on the glass panel

COG is an abbreviation for Chip On Glass, which is a bonding method in which a flip chip is bonded on a glass substrate by thermal crimping with ACF.

The mainstream method is to bond the driver IC required to drive a flat panel display such as an LCD directly on the panel. This is COG bonding, and in addition to this, in order to realize a narrow frame display, driver bonding is done on the FPC (COF), and a structure that narrows the total frame by pinching pitch FOG has also been adopted.
Due to the improvement of LCD resolution / definition, driver ICs are becoming more and more pinned and pitched, and the shape of the IC is becoming more elongated.

We have many years of experience in supporting COG, and we can handle various COG bonding.