About FOG
It is an bonding that mechanically fixes while conducting between the film (FPC) and glass.
FOG is an acronym for Film On Glass, which means bonding FPC on a glass substrate.
FPC is mainly bonded on glass panels such as LCDs, but FPC bonding on glass is called FOG, not limited to displays.
The bonding method is thermocompression bonding (ACF crimping) using ACF.
Normally, FPCs with a terminal pitch of 80 to 200 μm are often bonded, but we have introduced a high-precision FOG bonding machine that can support bonding with a pitch of 26 μm, and are bonding various FOGs.
For pinch pitch bonding such as 26 μm, it is necessary not only to support the machine capacity of the bonding machine, but also to support FPC design and material management.
We also have various types of experience with ACF materials used for ACF crimping. ACF bonding that meets the conditions recommended by the ACF manufacturer can be performed.
We also support a wide range of FPC sizes that can be bonded, so please contact us if you have any problems with ACF crimping.