Semi-automatic vacuum seam welder
Defoamer
Specifications
- The capacity of the COB resin encapsulation process will be improved when combined with the resin encapsulation printing machine.
- As the machines for die bonders and wire bonders has been expanded, the resin sealing capacity has also increased, so we will respond to customer requests with greater mass production capabilities.
Desktop coating system with position correction function
Specifications
- 3D alignment function: Supports correction according to the inclination and swell of the pallet and work piece
- View camera: It is possible to measure coating dimensions from coating observation
- Equipped with application preview function: It is possible to check the coating pattern and coating line width
Underfill machine
Specifications
- Suitable for underfill of relatively small inserts of Φ2mm to Φ4mm
- By changing the tray, it can be applied not only to underfill but also to drawing and coating resin.
- Model of on-board dispenser: Sanei Tech e.star (= Akim Tech ACJ-3)
- * High-speed electromagnetically controlled non-contact dispenser
