FOG bonding machine
F-20
Basic specifications
- Corresponding panel dimensions: 5 inches
- Bonding length: 55mm
FOG bonding machine
FB-03
Basic specifications
- Corresponding panel dimensions: 150mm × 150mm
COG bonding machine
CB-2003
Basic specifications
- Corresponding panel dimensions: 5 inches
- Dr length: 55mm
- Bonding accuracy: ± 4.5 micron
Semi-automatic ACF bonding machine
ABM-411 (OHASHI ENGINEERING)
Basic specifications
- This is a semi-automatic machine, we will make a small turn and support trial production in small quantities.
Semi-automatic flip chip bonding machine
CB501 (Athlete)
Basic specifications
- Corresponding IC size: 20mm × 20mm
- Corresponding board size: 60mm × 60mm
- Weighting capacity: 100g-50kg
- Heating capacity: Room temperature to 500 ° C (setting)
By manual operation for the supply and removal materials of the product, it is possible to respond to "non-standard" prototypes with a small turn.
We accept contracts for difficult prototypes that are difficult to handle with fully automatic machines.