FPC bonding machine (high pressure type)

High Load Bonder FS3715 (Ishiyama)

Basic specifications
  • Pressurized pressure: 20 - 140 kgf
  • Set temperature: Room temperature to 500 ℃
  • Bonding time: 0 - 99.9 seconds
  • Corresponding panel size: 150 × 100-450 × 250 mm
  • Corresponding FPC size: 40 × 20-450 × 250 mm
  • ESD measures: Static discharge blower from the side of the stage

High-precision laminating machine

Basic specifications
  • Corresponding panel size: 4 to 13.3 inches
  • laminating accuracy: ± 0.05 mm
  • Work holding with a holding sheet that does not allow air bubbles to enter the front and rear ends

Semi-automatic sheet-fed laminating machine

SE650n (CLIMB PRODUCTS)

Basic specifications
  • Corresponding size: Max. 500 (W) × 600 (L) × total 15 (t) mm
  • Weight: up to 3 kg
  • Laminating accuracy: ± 0.1 mm (machine repeatability ± 0.02 mm)

This is a semi-automatic sheet-fed laminating machine that laminates films with rollers under atmospheric pressure.
High-precision laminating of ± 0.1 mm can be performed on work pieces of up to 500 × 600 mm by camera alignment.

ACF bonding machine

AD-AC-500H (ADVANCEL)

Basic specifications
  • Corresponding panel (PCB board) dimensions: MAX width up to 500 mm (panel size guideline: 6 inches to 23 inches)
  • Corresponding panel (PCB board) Thickness: 0.4-1.0mm
  • ACF width: 1.0-3.0mm
  • Pressurizing capacity: 290-1080N (30-110kgf)

FOG bonding machine

AD-530SC (ADVANCEL)

Basic specifications
  • Corresponding panel (PCB board) dimensions: MAX width up to 500 mm (panel size guideline: 6 inches to 23 inches)
  • Pressurized cylinder stroke: 30mm
  • Pressurized head thrust: MAX500kgf

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