Vacuum laminating machine
With camera alignment, it is possible to laminate with high accuracy of ± 0.05 mm between alignment marks.
For alignment, you can use specially formed marks, print openings, film and panel outlines, panel active areas, and other areas that can be seen with the camera.
The laminating objects can be used not only for rigid bodies such as glass panels and cover glasses, but also for attaching films to glass and attaching films to each other.
Since the total height of the laminating object and the laminated object is up to 150 mm, it can be laminated on complicated shapes.
As for the shape, it can be used not only for planes but also for 2.5D and 3D shapes. When attaching to a three-dimensional object or curved surface shape, it is necessary to confirm whether the device can be supported on a case-by-case basis, so it is necessary to confirm whether it can be supported each time.
Autoclave that can be used for large products (installed in December 2020)
358L(Kurihara Seisakusho)
Bare chip bonding on the board
COB is an acronym for Chip On Board. A general term for technologies for bonding chips on a board (PCB board).
Since the semiconductor bare chip is bonded directly on the substrate, space-saving bonding and low-profile bonding are possible compared to bonding packaged products.
There are various methods for connecting to the board, but the most typical method is wire bonding. (Sometimes abbreviated as WB)
What is wire bonding?
A metal wire is used to connect the circuit pattern on the board and the electrode of the chip. The gold wire is joined to the aluminum electrode and gold terminal by heat, ultrasonic waves, and load. The bonding area can be made smaller than that of SMT, and the printed circuit board can be made smaller.
Bonding type
The role of wire bonding is to electrically bond the inside and outside of the IC, and the technologies used include the thermo-compression method, which joins by applying heat and load, and the thermosonic method, which also uses ultrasonic waves. I have.
Bonding process
◎ Ball bonding
A method often used in mass production factories, wires are passed from directly above to directly below a tool called a capillary. You can make a loop in all directions of 360 degrees where it contacts the bonding surface, but you can't use a very thick wire because it make a ball using sparks.
◎ Wedge bonding
A wedge tool is used for bonding. Unlike ball bonding, we don't have to blow sparks to melt the wire, so use can use its wire, such as aluminum wire, in addition to gold wire. Wedges can only be looped in one direction, but we can do bonding with ribbons and thick wires (wires of 100 μmφ or larger).
We can handle various types of gold wire, aluminum wire (thin wire, thick wire), aluminum, and gold ribbon. We also undertake a small number of prototypes. We also perform wiring processing for bare chip evaluation and evaluation of board bondability using plasma cleaning equipment.
COB wire bonding example of integrated circuit IC (left) and wire bonding example of LED chip (right)
Please feel free to contact us from the inquiry page for various experiments, prototypes, mass production.