ACF Bonding Machine
Specifications
- Connection between glass substrate (panel) and FPC using ACF (anisotropic conductive film)
- COG (Chip On Glass), COF (Chip On Film), etc.
- Applications as a connector substitute / solder substitute
ACF Main Crimping Machine
Specifications
- ACF can be bonded on a large panel
- Board size : 20 inch panel ~ compatible
- Substrate thickness : 0.4 mm to 2.5 mm
- Head pressure : 30-900N / head (5-30kgf / head)
- Head pressurization time : 0.1-99.9sec variable
- Head heating method : Room temperature to 350 ° C (cartridge heater)
Semi-automatic ACF Applying Machine
ABM-411 (OHASHI ENGINEERING)
Specifications
- This is semi-automatic machine, we will make a small turn and support trial production in small quantities.
Flip-Chip (High-Precision) Bonder
FCB3 (Panasonic)
Specifications
- Bonding position accuracy : 3 micron / 3σ (manufacturer's guaranteed spec.)
- High-precision bonding of 0.3 mm square LED bare chips is possible
- Pressurized range : 5N to 490N
- Heating range : Max.500℃
- ESC method is possible
Flip-Chip Bonder
FCB3 (Panasonic)
Specifications
- Board size : 50 x 50 mm to 330 x 250 mm
- Die size : 1 x 1 mm to 20 x 20 mm
- Bonding accuracy : 3 micron / 3σ Pressurization range: 5 to 490 N
- Heating range : Max 500 ℃
- Tip supply : WF / Max 8 inch or 2 inch tray / 4 inch tray