In order to quickly respond to the ever-accelerating electronicization of various devices and their small size, light weight, multi-functionality, and high performance, we have introduced a state-of-the-art mounting line, from board design to parts procurement, trial production, and mass production. We can handle a wide range of applications such as dipping, dipping, and hand soldering.
We will meet various needs with high technology of board mounting and surface mounting and thorough quality control ability.

• Not only PCB boards, but also FPC boards for board mounting and surface mounting.
• Supports narrow pitch and extremely small parts such as CSP, BGA, QFP, 0402, 0603, which require a mounting system for board mounting.
• We have 8-zone N2 reflow, and the optimum temperature profile can be set by mounting on a board.
• RoHS compliant and lead-free from the viewpoint of environmental protection.
• Board size for board mounting and surface mounting
  50 mm x 50 mm to 250 mm x 330 mm t = 50 μm to 2.0 mm

Printing mask production

We will manufacture it from the manufacturing data of the board.
We manufacture not only Gerber data and DXF data but also boards.

Processing method

• Laser method
  A highly accurate metal mask that is laser processed.
  Suitable for surface board mounting with 0.4 mm fine pitch.
• Etching method
  A metal mask with stable accuracy due to photo-etching. Suitable for general density surface board mounting.
• Additive method
  A highly accurate metal mask made by electroforming.
  Suitable for high-density surface board mounting with an ultra-fine pitch of 0.3 mm. Since the cross section of the opening is smooth, the paste solder can be easily removed.

• Applicable package size: 2.0mm - 6.0mm
• Sealing Pressure: atmospheric - high vacuum (5x10-3 Pa or lower)
• Used gas: N2 We do have experience with other kinds of gases. Please feel free to consult with us. Moreover, it is possible to measure and control the dew-point temperature in chambers and we are pleased to provide detail information on your request.
• Respond to request for MEMS prototyping, small-quantity production, and whatsoever!
• We propose the total line solutions from package production to quality verification!

Just provide us with your specification/drawings:

• Assembly
• Sealing
• Leak Test
• Packing / Delivery

• Mounting forms include interconnection between glass substrate (panel) and FPC, COG (Chip On Glass) bonding, COF (Chip On Film) bonding, substitution for connector or solder, etc.
• We can provide the total line solutions from prototyping to small-quantity production (about 10 to 5,000 pieces).

Main Mounting Forms

Mounting with ACF (Anisotropic Conductive Film)

• interconnection between glass substrate (panel) and FPC
• COG (Chip On Glass) bonding
• COF (Chip on FPC) bonding
• used as an alternative for connector - interconnection with ACF between FPC and PCB avoids needs for connectors

Other Available Services

• Respond to all requests for bonding of 1 piece of substrate, 1 piece of panel, etc.
• Quick delivery
• Procure ACF for you from:
  ・Dexerials
  ・Hitachi Chemical Company
• Feel free to consult with us about mass production.

• Respond to any small request for bonding:1 string of wire, 1 piece of panel, etc.
• Quick delivery.
• Heavy cutting, irregular shape, deep access, etc.
• Hybrid mounting of bare chip and SMT (Surface Mount Technology) (We will support small-quantity production without solder mask.)
• Rework/repair work of even one piece of wire available

• Board Design↓
• Required Materials procurement↓
  *Respond to request for back grind and dicing of IC chips and tray conveyance.
• Mounting↓
• Assembly↓
• Rework / Repair↓
• Quality Evaluation / Assurance↓
• Delivery

Ordering Information (Unit/Form)
MEMS Package (Sealing/Seam welding)

• sensor of sealing with seam welding
• gas seal with N2 and other gases
• checking with leak testers
• quartz crystal oscillator, etc.

Bonding Material/Method

• 電解Ni
• 無電解Ni
• 金錫

Ordering Information (Unit/Form)
Middle to Small-Scale LCD Panel

• flip-chip bonding of Dr-IC on panel with ACF (COG)
• flip-chip bonding of Dr-IC on FPC with ACF (COG)
• interconnection between LCD panel and FPC with ACF (FOG)
• from design to prototyping of display unit
• OCA, OCR bonding
• mounting and assembly of touch panel

Bonding Material/Method

ACF (to ACF Mounting page)

Ordering Information (Unit/Form)
Print Head

• mounting of Dr-IC on ceramic substrate with ACF
• interconnection between control board and FPC with ACF
• die-bonding/thin aluminum wire bonding of LED elements
• interconnection between PCB and ceramic substrate with gold wire bonding

Bonding Material/Method

• ACF (to ACF Interconnection page)
• thin Aluminum wire (to Wire Bonding page)
• Gold wire (to Wire Bonding page)

Ordering Information (Unit/Form)
Display/Dial Face Light-Emitter

• die-bonding/thin aluminum wire bonding of LED on FPC
• die-bonding/gold ball bonding
• wire connection by gold ball bonding between PCB and glass substrate of digital display (EPD)

Bonding Material/Method

• thin Aluminum wire (to Wire Bonding page)
• gold wire (to Wire Bonding page)

Ordering Information (Unit/Form)
Chip Mounting of High Frequency Circuit Board

• mounting by gold ribbon bonding

Bonding Material/Method

• gold ribbon (to Wire Bonding page)

Ordering Information (Unit/Form)
Power Supply Circuit

• die bonding/thick Aluminum wedge bonding of IGBT to PCB

Ordering Information (Unit/Form)
Control Board

• interconnection between PCB and FPC with ACF

Bonding Material/Method

• thick Aluminum wire (to Wire Bonding page)
• Aluminum ribbon (to Wire Bonding page)
• ACF (to ACF Mounting page)

Ordering Information (Unit/Form)
Sensing Portion

• high-precision die bonding/gold wire bonding of PD to FPC
• high-precision die bonding/gold wire bonding of LED to FPC

Bonding Material/Method

• gold wire (to Wire Bonding page)

Ordering Information (Unit/Form)
Image Sensor

• high-precision die-bonding/gold ball bonding of large-scale CMOS sensor to ceramic PKG

Bonding Material/Method

• gold wire (to Wire Bonding page)

Ordering Information (Unit/Form)
RF Element Mounting

• RF element mounting on paper substrate (Heat and Pressure FCB/gold WB)

Bonding Material/Method

• gold wire (to Wire Bonding page)

Ordering Information (Unit/Form)
Board for GPS

• C4 mounting of GPS functional IC

Bonding Material/Method

• Solder (to Flip-Chip Bonder page)

Ordering Information (Unit/Form)
Resin Bonding Material Development/ Ceramic Bonding Material Development/Plating Evaluation/Engineering Plastic Bonding Material Evaluation

• evaluation of prototype of newly developed circuit board
• evaluation of products made in factories abroad
• mountability evaluation for development of various bonding materials

Bonding Material/Method

• X-ray inspection, bonding strength measurement, thermal shock test, heat cycle test (to Quality Evaluation/Tests page)

Order Information (Unit/Form)
Repair of Developed Product/Wire Bonding Rework/Prototyping of New Product at Early-stage of Development Without Applying Mounting Rules

• We want to make good use of the few prototype IC's and substrates. Can we recycle and reuse those after test and evaluation?
• Some wire accidentally collapsed during evaluation.
• We have made a prototype and its profile exceeds the specs of our own machine, but we want to transfer it to mounting by all means.

Bonding Material/Method

• Ggold wedge bonding, gold ribbon bonding, thick aluminum wire bonding, aluminum ribbon bonding, thin aluminum wire bonding (to Wire-Bonding page)