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Ings Shinano undertakes EMS (Electronic Manufacturing Services) and OEM production, which undertakes everything from design and trial production of electronic devices to mass production and shipping.
Features of Ings Shinano EMS / OEM contract manufacturing
Providing one-stop service
Procurement, selection of suppliers, cost reduction, partner companies
Assembly work in a clean room
We have a 3300m2 (9 floors) clean room (managed by 0.5μ particles 300-3000 or less) and achieves high quality in a clean environment.
Human resources who have received advanced skills and technical education (national certification) for assembling electronic components
We can also handle assembly work that requires advanced skills such as electronic equipment assembly and optical equipment assembly (some human resources have acquired the first grade of optical equipment assembly, which is a national certification).
Supporting manufacturing with bonding technology cultivated through various prototypes
We are making a large number of various prototypes such as bare chip bonding and display module bonding. Our technology is useful in the manufacture of electronic devices with various mountings.
Product concept realization ability unique to abundant prototype experience
We have the ability to realize commercialization from various aspects of cost, quality, and technology.
This is because we can undertake development contracts to realize our customers' "product planning concepts" with the comprehensive strength of bonding, display modules, optical equipment, and precision equipment assembly such as electronic devices.
Product case
Composite IoT sensor
A small IoT product that requires multiple sensing functions and wireless communication functions.
Scope of contract: Housing design / manufacturing, assembly, inspection
Assembly of other products
Mechanical equipment assembly, Optical equipment assembly, Electrical / electronic equipment assembly, Information related equipment assembly, Measurement equipment assembly, Office equipment assembly, Crystal oscillator assembly & inspection, Integrated assembly from built-in board mounting
Quality control / product evaluation
Obtained ISO9001 and IATF16949
We implement customer inspection and quality standards to the field level and appropriately perform quality control.
In December 1999, we acquired the quality management system ISO9001 certification. December 2016 we also acquired ISO9001: 2015 version of certification registration certificate, and the transition of 2015 version has been completed.
In addition, on February 21, 2019, the in-vehicle quality management system acquired IATF 16949 standard certification from the inspection body (BVCC).
Product evaluation
We strongly support our customers' quality activities such as quality and reliability evaluation of various information devices, electronic parts, electrical parts, boards, and units.
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The feature of our ACF bonding process is the wide range of support that we have cultivated through many years of trial production.
We have responded to various bonding widths, bonding pitches, and variations of materials.
The bonding conditions are set and bonded so that they meet the recommended conditions of the ACF manufacturer each time.
Therefore, if you specify the conditions, it is possible to bond with the supplied ACF.
FPC is not only supplied, but we can also design and procure FPC and perform ACF bonding by our arrangement.
Regarding the supplied items, if you consult us in advance, we can incorporate a design suitable for ACF bonding into the FPC or the board.
We will respond in 2 days at the earliest.
Please feel free to contact us using the inquiry form.
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Respond to any small request for bonding:1 string of wire, 1 piece of panel, etc.
Quick delivery.
gold wire, aluminum wire, gold wire ribbon, etc.
Mounting forms include interconnection between glass substrate (panel) and FPC, COG (Chip On Glass) bonding, COF (Chip On Film) bonding, substitution for connector or solder, etc.
We perform airtight sealing centered on seam welding technology for sealing LEDs and MEMS.
It supports not only vacuum but also filling of inert gas and leak test.
IH spot reflow is a technology that uses induction heating (IH) to locally heat only the metal part and perform soldering.
Since it is heated by induction heating, only metals such as solder and leads generate heat.
In addition to the technical aspects, we provide full support for operations related to prototype evaluation by providing small-scale support such as procurement and single-shot trial production.
Main machines
| Rotary head (automatic) Aluminum thin wire bonder | Wire diameter: 25-75 μm
Minimum pad pitch: 100 μm
Bonding area: 300 x 160 mm |
|---|---|
| Gold wire Wire bonder Wire diameter: | Wire diameter: 18-50 μm Minimum pad pitch: 50 μm Board size: 80 x 250 mm |
| Mini LED die bonder | Board size: □ 300 mm
Chip size: □ 0.1mm ~ □ 1.1mm
On-board bonding accuracy: ± 25 μm (3σ) (both x and y) |
| High-precision flip-chip bonder | Bonding position accuracy: 3 μm (3σ)
High-precision bonding of 0.3 mm square LED bare chips is possible
Pressurized range: 5N to 490N
Heating range: Max.500 ℃ |
| IH spot reflow | Single head basic evaluation equipment |
Abundant problem-solving achievements and experience points. Introduction of proposal cases
Equipped with LED for evaluation of developed products of paste material for wiring
Connection of film material with low heat resistance and FPC
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Now that the LED bonding is complete, all we have to do is make it shine.
This is an LED driver board using HT16K33 sold by Akizuki Denshi.
HT16K33 board
The good point is that it is easy to obtain, but even if we look at the specifications, it is not clear how much LED current flows and whether we can set the amount of current. we think this IC is not suitable for proper LED evaluation.
The overall brightness can be changed in 16 steps, but the brightness of each LED cannot be changed.
A state where the driver IC board is placed
This board is bonded on the back, which is the board on which the LED is bonded.
In addition, the IC is controlled by I2C, and up to 8 addresses can be set by jumper setting, so up to 8 boards can be moved side by side.
Assuming that they will be moved side by side, the power supply and I2C lines can be easily soldered to the board.
The photo above shows two boards side by side. Adjacent boards can be connected to each other where SCL, SDA, VDD, and GND are written.
First, connect one.
Solder the HT16K33 board and solder it to the I2C of the microcomputer board.
Soldered and connected to the microcomputer
Create a program to turn it on and write it to check the lighting.
Lighting of mini LED
This IC seems to be used a lot for hobbies, and there are many hints to make it work, so it was easy to move.
In the photo, the third line from the bottom is dark, but due to the relationship between time division drive and shutter speed, the entire surface actually emits light evenly.
Finally, we will line up a lot of these boards and aim for completion using our other technology, "bonding" technology.